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METHODS FOR HIGH TEMPERATURE ETCHING A MATERIAL LAYER USING PROTECTION COATING
专利权人:
Applied Materials, Inc.
发明人:
ZHOU Hailong,LEE Gene,PATIL Abhijit,JIANG Shan,MEHROTRA Akhil,KIM Jonathan
申请号:
US201615216948
公开号:
US2018025914(A1)
申请日:
2016.07.22
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
Methods for etching a bottom anti-reflective coating (BARC) and/or an anti-reflective coating (ARC) and/or a dielectric anti-reflective coating (DARC) to form high aspect ratio features using an etch process are provided. The methods described herein advantageously facilitate profile and dimension control of features with high aspect ratios through a proper sidewall and bottom management scheme during the bottom anti-reflective coating (BARC) and/or an anti-reflective coating (ARC) and/or a dielectric anti-reflective coating (DARC) open process. In one embodiment, a method for etching a dielectric anti-reflective coating (DARC) layer to form features in the DARC layer includes supplying an etching gas mixture onto a DARC layer disposed on a substrate, wherein the substrate is disposed on a substrate support pedestal assembly disposed in a processing chamber, controlling a temperature of the substrate support pedestal assembly greater than 110 degrees Celsius, and etching the DARC layer disposed on the substra
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