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Monitoring device, monitoring method, and device for cutting and grinding display substrate
专利权人:
BOE TECHNOLOGY GROUP CO., LTD.;HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
发明人:
Jing Yangkun,Wu Weimin,Che Xiaopan,Li Haibo,Li Gui,Sun Jian,Xia Junwei,Ding Jia
申请号:
US201514801916
公开号:
US10139802(B2)
申请日:
2015.07.17
申请国别(地区):
美国
年份:
2018
代理人:
Brooks Kushman P.C.
摘要:
The present disclosure provides a monitoring device, a monitoring method and a device for cutting a display substrate. The monitoring device includes an infrared temperature detection module configured to detect a temperature at a contacting position where a cutter wheel is in contact with the display substrate when cutting the display substrate with the cutter wheel, so as to acquire a temperature parameter at the contacting position; and a processing module configured to generate, based on the temperature parameter, a corresponding control parameter for controlling the process of cutting the display substrate.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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