The endoscope apparatus includes a solid-state imaging device having a light-receiving surface on the surface, and a substrate that is disposed on the back side of the solid-state imaging device and from which a part of the wiring pattern is exposed on the tip side that is the solid-state imaging device side And a first heat dissipating member disposed between the solid-state imaging device and the exposed portion of the wiring pattern, and a cable electrically connected to the wiring pattern. 内視鏡装置は、受光面を表面に有する固体撮像素子と、前記固体撮像素子の裏面側に配置され、前記固体撮像素子側である先端側において、配線パターンの一部が露出している基板と、前記固体撮像素子と、前記配線パターンの露出部分との間に配置される第１の放熱部材と、前記配線パターンと電気的に接続されるケーブルと、を備えたことを特徴とする。
