SCHNEIDER UWE,LONG MICHAEL DEVIN,ORDWAY DAVID CARLTON
申请号：
IN201717026581
公开号：
IN201717026581A
申请日:
2017.07.26
申请国别(地区):
IN
年份:
2017
代理人:
摘要：
method for mechanically deforming, such as by bonding, a substrate assembly. The substrate assembly may be advanced at first velocity toward a bonder apparatus. The bonder apparatus may rotate at a second velocity, which is less than or equal to the first velocity. The bonder apparatus may include a support surface and a process assembly. The substrate assembly may be contracted prior to advancing onto the bonder apparatus. A first process assembly may receive a leading portion of the substrate assembly and a subsequent process assembly may receive a trailing portion. The leading portion and the trailing portion define a product arc length, which is less than or equal to a process product pitch. One or more processes may be performed on the substrate assembly. The substrate assembly may then be removed from the apparatus and advanced through a metering assembly such that the substrate assembly exits at the first velocity and may be ex panded such that the leading portion and the trailing portion are separated by the process product pitch.
