您的位置: 首页 > 农业专利 > 详情页

METHODS FOR BONDING SUBSTRATES
专利权人:
发明人:
申请号:
EP16704371.0
公开号:
EP3253346A1
申请日:
2016.02.04
申请国别(地区):
EP
年份:
2017
代理人:
摘要:
A method for mechanically deforming, such as by bonding, a substrate assembly. The substrate assembly may be advanced at first velocity toward a bonder apparatus. The bonder apparatus may rotate at a second velocity, which is less than or equal to the first velocity. The bonder apparatus may include a support surface and a process assembly. The substrate assembly may be contracted prior to advancing onto the bonder apparatus. A first process assembly may receive a leading portion of the substrate assembly and a subsequent process assembly may receive a trailing portion. The leading portion and the trailing portion define a product arc length, which is less than or equal to a process product pitch. One or more processes may be performed on the substrate assembly. The substrate assembly may then be removed from the apparatus and advanced through a metering assembly such that the substrate assembly exits at the first velocity and may be expanded such that the leading portion and the trailing portion are separated by the process product pitch.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充