Botula Alan B.,Lifson Max L.,Slinkman James A.,Van Kessel Theodore G.,Wolf Randy L.
申请号：
US201615074165
公开号：
US9666701(B2)
申请日:
2016.03.18
申请国别(地区):
美国
年份:
2017
代理人:
Meyers Steven`Calderon Andrew M.`Roberts Mlotkowski Safran, Cole & Calderon, P.C.
摘要：
An approach for heat dissipation in integrated circuit devices is provided. A method includes forming an isolation layer on an electrically conductive feature of an integrated circuit device. The method also includes forming an electrically conductive layer on the isolation layer. The method additionally includes forming a plurality of nanowire structures on a surface of the electrically conductive layer.
