A flexible electronic device is provided that includes electronics, metal traces, and other components at least partially encapsulated in a protective, corrosion- and fluid-resistant encapsulating adhesive coating. The device include electronics, sensors, and other components disposed on a flexible substrate that is configured to be mounted to a body or disposed in some other environment of interest. The encapsulating adhesive coating is flexible and adheres securely to the electronics, metal traces, and other components disposed on the flexible substrate. The encapsulating adhesive coating prevents voids from forming proximate the components within which water or other chemicals could be deposited from the environment of the device. The encapsulating adhesive coating could include silicone or other flexible highly adhesive substances. The encapsulating adhesive coating could be a conformal coating.
