A flexible electronic device is provided that includes electronics, metal traces, and other components at least partially encapsulated in a protective, corrosion- and fluid-resistant encapsulating adhesive coating. The device include electronics, sensors, and other components disposed on a flexible substrate that is configured to be mounted to a body or disposed in some other environment of interest. The encapsulating adhesive coating is flexible and adheres securely to the electronics, metal traces, and other components disposed on the flexible substrate. The encapsulating adhesive coating prevents voids from forming proximate the components within which water or other chemicals could be deposited from the environment of the device.The encapsulating adhesive coating could include silicone or other flexible highly adhesive substances. The encapsulating adhesive coating could be a conformal coating.本發明提供一種可撓性電子裝置，其包括至少部分地封裝於保護性耐腐蝕及耐流體之封裝黏著劑塗層中之電子組件、金屬跡線及其他組件。該裝置包括安置於可撓性基板上之電子組件、感測器及其他組件，該可撓性基板經組態以安裝至身體或安置於所關注之一些其他環境中。該封裝黏著劑塗層為可撓性的且牢固地黏著至安置於該可撓性基板上之該等電子組件、金屬跡線及其他組件。該封裝黏著劑塗層防止在該等組件附近形成水或其他化學物質會自該裝置之環境中沈積於其內部的空隙。該封裝黏著劑塗層可包括聚矽氧或其他可撓性高黏著性物質。該封裝黏著劑塗層可為保形塗層。
