METHOD AND APPARATUS FOR WELDING PRINTED CIRCUITS

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专利权人:

CEDAL EQUIPMENT S.R.L.

发明人:

CERASO Bruno

申请号：

US201615358389

公开号：

US2017079148(A1)

申请日:

2016.11.22

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

An induction head for bonding stacked layers (19, 20) for making printed circuits, by electromagnetic induction. A magnetic flux is locally induced at a plurality of conducting spacers (25) provided along a peripheral area (22) of the multilayer stack (18). With this induction head, it is possible to induce magnetic fluxes with opposite sign in individual areas of the peripheral are, thus achieving the maximum energy efficiency during the bonding process.

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中国工程科技知识中心

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