Wen H. Ko,Shem Lachman,Christian A. Zorman,Leping Bu
申请号：
US13888731
公开号：
US20130316180A1
申请日:
2013.05.07
申请国别(地区):
US
年份:
2013
代理人:
摘要：
A method for forming an electrical-conductor-free vapor barrier suitable for protecting long-term implanted electronic systems is disclosed. The method comprises forming a nascent layer of a partially cured layer and repeatedly compressing the layer via a roller-based process. Once the layer has been suitably compressed, the layer is fully cured. In some embodiments, a multi-layer protective layer is formed by repeating the roller-based formation process for each of a plurality of layers. In some embodiments, a multi-layer protective layer comprising layers of different materials is formed.
