The present invention relates to an ion exchange resin comprising a crosslinked resin and a salt covalently bonded to a carbon of the resin. The salt comprises a first non-metallic cation and a first counteranion, wherein the first counteranion comprises a second non-metallic cation and a thiosulfate counteranion, and wherein the ion exchange resin is essentially free of metals. The ion exchange resin is especially useful for removing impurities from solutions that are useful for manufacturing semiconductor devices.