Short, JR. Byron Elliott,Francis Nathan R.,Brandt David B.
申请号：
US201615002256
公开号：
US2017208706(A1)
申请日:
2016.01.20
申请国别(地区):
美国
年份:
2017
代理人:
摘要：
One or both of a module cover and a heat sink for a circuit card module includes a multi-level cooling structure formed by a body, sidewalls extending from edges of the body and, together with the body, partially enclosing a volume, flanges projecting from ends of the sidewalls opposite the body and away from the volume, and an oscillating heat pipe within the body, the sidewalls, and the flanges. The oscillating heat pipe fluid path repeatedly traverses the body, a length of each of the sidewalls, and a portion of each of the flanges. The oscillating heat pipe provides cooling through both phase change of fluid slugs and vapor bubbles within the oscillating heat pipe and movement of the fluid slugs and the vapor bubbles along the fluid path between an evaporator adjacent a first of the flanges and a condenser adjacent a second of the flanges.
