Ken YAMAMOTO,Takuro SUYAMA,Takahiro SHIMOHATA,Takatoshi IGARASHI,Hiroshi KOBAYASHI
申请号：
US16403782
公开号：
US20190260917A1
申请日:
2019.05.06
申请国别(地区):
US
年份:
2019
代理人:
摘要：
An image pickup module including: an image pickup unit having a plurality of stacked semiconductor devices, the plurality of stacked semiconductor devices including an image pickup sensor； and a frame including a hollow portion in which the image pickup unit is inserted, wherein the image pickup unit includes a first side surface orthogonal to a principal surface of the image pickup sensor, and a second side surface opposed to the first side surface, and two edges of four edges defining the first side surface of the image pickup unit are in contact with an inner surface of the frame, the two edges being orthogonal to the principal surface of the image pickup device, and the second side surface is not in contact with the inner surface of the frame.
