An apparatus includes at least a first IC die and a second IC die. Bottom surfaces of the first and second IC dice include a first plurality of connection pads and top surfaces of the first and second IC dice include a second plurality of connection pads. The apparatus also includes a layer of non-conductive material covering the top surfaces of the first and second IC dice, a plurality of through-vias, first conductive interconnect between at least a portion of the first plurality of connection pads and at least one through via, and second conductive interconnect on a top surface of the layer of non-conductive material that provides electrical continuity between at least a portion of the second plurality of connection pads and at least one through-via of the plurality of through-vias.
