Long-term packaging for the protection of implant electronics

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专利权人:

California Institute of Technology

发明人:

Yu-Chong Tai,Han-Chieh Chang

申请号：

US14142180

公开号：

US09781842B2

申请日:

2013.12.27

申请国别(地区):

US

年份:

2017

代理人:

摘要：

The present invention provides a micropackaged device comprising: a substrate for securing a device； a corrosion barrier affixed to said substrate； optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device； and an encapsulation material layer configured to encapsulate the micropackaged device.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/