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STRUCTURE FORMED ON SUBSTRATE, STRUCTURE MANUFACTURING METHOD AND LINE PATTERN
专利权人:
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
发明人:
AKEDO Jun,ENDO Akito
申请号:
US201715717029
公开号:
US2018020553(A1)
申请日:
2017.09.27
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
Provided are a structure for which ink wettability/spreadability in the width direction of a line drawn on a substrate is limited and a high aspect ratio can be achieved, a manufacturing method for said structure, and a line pattern. The present invention provides a structure comprising: a droplet overlapping solidification layer obtained by droplets sloping and continuously overlapping each other in the direction of movement of a substrate and solidifying, a droplet flow solidified layer obtained by the droplets flowing on the droplet overlapping solidification layer and continuously being solidified without the droplets overlapping, and recesses formed at the boundary region between the droplet overlapping solidification layer and the droplet flow solidified layer.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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