PROBLEM TO BE SOLVED: To suppress adverse effects of temperature change in an amplification circuit and a power supply circuit or a change in ambient temperature on a semiconductor layer while miniaturizing a two-dimensional image pickup device.SOLUTION: A passage 51 is provided inside a base board 5, and an active matrix board 3 is disposed on the surface. A thin-wall section 53 is provided in the back face of the base board 5, the amplification circuit 4 is disposed with an element facing outward, and the amplification circuit and a section 52 other than the thin-wall section are thermally connected by heat conduction means 6 such as a graphite sheet. Alternatively, a power supply circuit board 11 is disposed in the section 52 other than the thin-wall section. A temperature control heat medium passing though the passage 51 exhausts heat generated in the amplification circuit 4 and the power supply circuit board 11 and suppresses the temperature change in the semiconductor layer 2.COPYRIGHT: (C)2009,JPO&INPIT【課題】二次元撮像装置を小型化しつつ、増幅回路や電源回路の温度変化若しくは環境温度の変化が半導体層に与える悪影響を抑制する。【解決手段】ベース基板5の内部に流路51を設け、表面にアクティブマトリクス基板3を配置する。ベース基板5の裏面に肉薄部53を設け、そこに増幅回路4を素子が外側を向くように配置するとともに、グラファイトシートなどの熱伝導手段6によって、増幅回路4と肉薄部以外の部分52とを熱的に接続する。また、電源回路基板11を、肉薄部以外の部分52に配置する。流路51を通る温度制御用の熱媒体によって、増幅回路4及び電源回路基板11で生じた熱を排熱するとともに、半導体層2の温度変化を抑制する。【選択図】図4
