A method according to one embodiment includes lapping an end of a section of a thin film wafer for polishing the end of the section, the section having a plurality of rows of transducers formed on a substrate. A bearing surface slot is formed in the polished end at a location that defines a tape bearing surface extending between the bearing surface slot and portions of the transducers exposed on the polished end. A row is sliced from the section, the row having the polished end and bearing surface slot.