Dewey, III Lewis W.,Rose Ronald D.,Widiger David J.
申请号：
US201514970745
公开号：
US2017177776(A1)
申请日:
2015.12.16
申请国别(地区):
美国
年份:
2017
代理人:
摘要：
Aspects of the present invention include a method, system and computer program product. The method includes identifying an overall shape as part of a design of circuitry of an integrated circuit or a semiconductor chip, and partitioning the overall shape into a plurality of sub-shapes. The method also includes performing a capacitance extraction for each sub-shape, each sub-shape including the sub-shape itself and at least one portion of at least one adjacent sub-shape, wherein the performing a capacitance extraction determines an amount of capacitance for each sub-shape. The method further includes combining the determined amount of capacitance for each sub-shape into a total determined amount of capacitance for the overall shape.
