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Work-in-progress substrate processing methods and systems for use in the fabrication of integrated circuits
专利权人:
GLOBALFOUNDRIES, INC.
发明人:
Oza Chinmay,Grau Gero,Fosnight William,Pabst Detlef
申请号:
US201414530947
公开号:
US9632499(B2)
申请日:
2014.11.03
申请国别(地区):
美国
年份:
2017
代理人:
Lorenz & Kopf, LLP
摘要:
Disclosed herein are methods and systems for semiconductor fabrication. In one embodiment, a method for fabricating semiconductors utilizing a semiconductor fabrication system includes performing a semiconductor fabrication process on a first lot of unprocessed semiconductor substrates with a semiconductor fabrication equipment unit to form a first lot of processed substrates and communicating processing data regarding the first lot of processed substrates from the semiconductor fabrication equipment unit to a just-in-time (JIT) module of the semiconductor fabrication system. The method further includes determining a processing priority of the first lot of processed substrates and a processing priority of a second lot of unprocessed substrates at the JIT module and scheduling removal of the first lot of processed substrates from the semiconductor fabrication equipment unit and delivery of the second lot of unprocessed substrates to the semiconductor fabrication equipment unit by the JIT module based on the pr
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