The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150°C) after having been held at a temperature of 150°C for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120°C, the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5 < S/R < 200 ...formula (1).