光硬化性導電材料、接続構造体の製造方法及び接続構造体

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专利权人:

積水化学工業株式会社

发明人:

上野山 伸也,真原 茂雄

申请号：

JP20140084549

公开号：

JP6285788(B2)

申请日:

2014.04.16

申请国别(地区):

日本

年份:

2018

代理人:

摘要：

PROBLEM TO BE SOLVED: To provide a photocurable conductive material which improves connection reliability of the to-be-connected members and conduction reliability between the electrodes when connecting electrodes of to-be-connected members.SOLUTION: A photocurable conductive material is used in electric connection between electrodes 2a and 3a and has photo-hardenability. The photocurable conductive material includes a conductive particle 22, a light reflection particle 23 composed of a material of a refractive index of 1.6 or greater and a binder resin 11 having photo-hardenability.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/