[Object] The present invention provides an aluminum alloy material which is bondable in a single-layer state without deformation before and after bonding and can be used in various aluminum alloy structures. [Solving Means] The aluminum alloy material containing Si: 1.0 mass% to 5.0 mass% and Fe: 0.01 mass% to 2.0 mass% with balance being Al and inevitable impurities, wherein 250 pcs/mm 2 or more to 7 x 10 5 pcs/mm 2 or less of Si-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 µm are present in a cross-section of the aluminum alloy material, while 100 pcs/mm 2 or more to 7 x 10 5 pcs/mm 2 or less of Al-based intermetallic compound particles having equivalent circle diameters of 0.5 to 5 µm are present in a cross-section of the aluminum alloy material. An aluminum alloy structure according to the present invention is manufactured by bonding two or more members in vacuum or a non-oxidizing atmosphere at temperature at which a ratio of a mass of a liquid phase gen
