The present invention relates to a high heat-dissipation LED substrate and a high heat-dissipation LED package using the substrate. The substrate comprises an insulating plate, a upper copper-cladding layer and a lower copper-cladding layer respectively provided on the upper and lower sides of the insulating plate; both the upper copper-cladding layer and the lower copper-cladding layer comprise heat dissipation areas and circuit areas mutually isolated; the insulating plate is provided with heat-conducting copper posts connected to the upper and lower heat dissipation areas and electric copper posts connected to the upper and lower circuit areas; the cross section of the copper post is round, 8-shaped or quincuncial; the circuit area surface of the upper copper-cladding layer is treated by roughening, and the heat dissipation area surface of the lower copper-cladding layer is provided convex-concave structures.
