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THERMAL BONDING SHEET, AND THERMAL BONDING SHEET WITH DICING TAPE
专利权人:
NITTO DENKO CORPORATION
发明人:
SUGO, Yuki,KAMAKURA, Nao
申请号:
WO2016JP77835
公开号:
WO2017057128(A1)
申请日:
2016.09.21
申请国别(地区):
世界知识产权组织国际局
年份:
2017
代理人:
摘要:
Provided is a thermal bonding sheet that prevents the material thereof from overflowing during adhering and from traveling up to the surface of the object to be adhered, and that obtains a strong sintered layer following sintering. A thermal bonding sheet provided with a layer in which, when the layer is analyzed by differential thermogravimetric analysis from 23°C to 500°C under the conditions of a temperature increase rate of 10°C/minute in air atmosphere, the value obtained by subtracting the weight loss (%) at 300°C from the weight loss (%) at 500°C is within the range of -1% to 0%.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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