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COMPONENT MOUNTING SYSTEM, COMPONENT MOUNTING SETTING UNIT, COMPONENT MOUNTING SETTING PROGRAM AND COMPONENT MOUNTING METHOD
专利权人:
HITACHI HIGH-TECH INSTRUMENTS CO LTD
发明人:
申请号:
JP20100240255
公开号:
JP2012094663(A)
申请日:
2010.10.27
申请国别(地区):
日本
年份:
2012
代理人:
摘要:
PROBLEM TO BE SOLVED: To provide a technique, which relates to a component mounting system and the like, that requires less preparation workload and thereby can increase an amount of substrate productions, even when the production plan is reviewed with high frequency. SOLUTION: A setting unit 3 that performs a component mounting setting in this component mounting system includes: means (301) that calculates a component availability index (b); means (302) that variably sets the size of area (A2) for addressing a change of production plan in a field of component supply means 13 in a component mounting unit 1; means (303) that places a component with a greater value b on the A2; means (307) that compares and determines whether a substrate production time excesses a permissible value. The setting unit 3 manages data of value b (D34), data of A2 (D35) and so on, updates the production conditions so that a component is placed on the A2 within a permissible deterioration range for the production time by using the above constitution, and outputs the information. COPYRIGHT: (C)2012,JPO&INPIT
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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