Via and trench filling using injection molded soldering

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专利权人:

International Business Machines Corporation

发明人:

John U. Knickerbocker,Shriya Kumar,Jae-Woong Nah

申请号：

US15214942

公开号：

US09861313B1

申请日:

2016.07.20

申请国别(地区):

US

年份:

2018

代理人:

摘要：

A method includes forming one or more trenches in a first substrate, forming one or more vias in a second substrate, aligning at least a first trench in the first substrate with at least a first via in the second substrate, and sealing the first substrate to the second substrate by filling the first via and the first trench with solder material using injection molded soldering.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/