您的位置: 首页 > 农业专利 > 详情页

High density multi-electrode array
专利权人:
International Business Machines Corporation
发明人:
Kangguo Cheng,Arjang Hassibi,Ali Khakifirooz,Dharmendra S. Modha
申请号:
US13798446
公开号:
US09087742B2
申请日:
2013.03.13
申请国别(地区):
US
年份:
2015
代理人:
摘要:
A high density micro-electrode array includes a transistor layer including a plurality of access transistors and a substrate in operable communication with the transistor layer including, wherein at least a portion of the substrate includes a plurality of trenches. The system includes a plurality of electrodes at least partially located in the plurality of trenches, wherein each of the plurality of electrodes is connected to at least one of the plurality of access transistors and wherein each of the electrodes is separated by a distance less than approximately one microns.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充