An image pickup apparatus includes a silicon layer, a rewiring layer including low-permittivity insulating bodies having a permittivity that is lower than a permittivity of silicon oxide, and a cover glass, and a cutout portion is provided in the silicon layer, wirings are provided on the cutout portion, the wirings do not cover at least a part of the low-permittivity insulating bodies in the rewiring layer, the low-permittivity insulating body being exposed at the cutout portion, and the cutout portion is covered by a second protection film including a metal material via a first protection film including an insulating material.
