PROBLEM TO BE SOLVED: To accurately shape a holding surface into a shape that can make the thickness of a wafer constant without leaving a non-grinding area on the outer periphery of the holding surface.SOLUTION: A holding surface can be shaped accurately to uniform the thickness of a recess area during a subsequent wafer grinding by a first grinding step of installing on grinding means 22 a grinding wheel for the holding surface with an outer diameter 317 of a grinding stone 31 being equal to that of a grinding wheel 30 for grinding a wafer and shaping a circular recess, rotating a chuck table 21, and grinding a center part of the holding surface 211 by the grinding means 22, and by a second grinding step of positioning the grinding means 22 and the chuck table 21 with a rotation axis 229 of the grinding means 22 being farther from a rotation axis 219 of the chuck table 21 than during the wafer grinding, rotating the chuck table 21, and grinding the outer periphery of the holding surface 211 by the grinding
