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THIN FILM RESISTIVE DEVICE FOR USE IN AN INTEGRATED CIRCUIT, AN INTEGRATED CIRCUIT INCLUDING A THIN FILM RESISTIVE DEVICE
专利权人:
Analog Devices Global
发明人:
Kubik Jan,Whiston Seamus P.,Doran Padraig Michael
申请号:
US201615000006
公开号:
US2017131368(A1)
申请日:
2016.01.18
申请国别(地区):
美国
年份:
2017
代理人:
摘要:
Thin film resistive sensors typically include a number of resistive components. These components should be well matched in order for the sensor to provide accurate readings. When a sensor is incorporated within an integrated circuit, the resistive components may be formed over, or under, metallic traces that form part of other components. As a result, the thin film resistive components are subjected to different levels of stress. This disclosure provides a structure that is arranged to mitigate the effects of stress.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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