THIN FILM RESISTIVE DEVICE FOR USE IN AN INTEGRATED CIRCUIT, AN INTEGRATED CIRCUIT INCLUDING A THIN FILM RESISTIVE DEVICE

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专利权人:

Analog Devices Global

发明人:

Kubik Jan,Whiston Seamus P.,Doran Padraig Michael

申请号：

US201615000006

公开号：

US2017131368(A1)

申请日:

2016.01.18

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

Thin film resistive sensors typically include a number of resistive components. These components should be well matched in order for the sensor to provide accurate readings. When a sensor is incorporated within an integrated circuit, the resistive components may be formed over, or under, metallic traces that form part of other components. As a result, the thin film resistive components are subjected to different levels of stress. This disclosure provides a structure that is arranged to mitigate the effects of stress.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/