ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC.;DOW GLOBAL TECHNOLOGIES LLC
发明人:
BAINIAN QIAN,GEORGE C. JACOB,DAVID SHIDNER
申请号：
KR20150179931
公开号：
KR20160075346(A)
申请日:
2015.12.16
申请国别(地区):
韩国
年份:
2016
代理人:
摘要：
The present invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material contains 4.2 to 7.5 weight percent fluid-filled polymeric microspheres in the isocyanate-terminated molecule. The fluid-filled polymeric microspheres are a blend of pre-expanded and unexpanded fluid-filled polymeric microspheres. The liquid polyurethane material contains a blend of pre-expanded and unexpanded fluid-filled polymeric microspheres having a relative viscosity μ / μ0 of 1.1 to 7. Then, the liquid polyurethane material solidifies into a polyurethane matrix that contains pre-expanded and expanded fluid-filled polymeric microsphere for forming the polishing pad.
