A fingerprint identification module includes a substrate, a fingerprint sensor and a covering plate. The fingerprint sensor is disposed on the substrate and electrically connected with the substrate. The fingerprint sensor detects a fingerprint image. The covering plate is located over the fingerprint sensor and combined with the fingerprint sensor through an adhesive layer. The adhesive layer is arranged between the covering plate and the fingerprint sensor, and includes a solid adhesive part and a liquid adhesive part. The liquid adhesive part is arranged around the solid adhesive part.
