Sensor device, sensor module, force detection device, and robot

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专利权人:

Seiko Epson Corporation

发明人:

Kamiya Toshiyuki,Kawai Hiroki

申请号：

US201615198822

公开号：

US9677953(B2)

申请日:

2016.06.30

申请国别(地区):

美国

年份:

2017

代理人:

Harness, Dickey & Pierce, P.L.C.

摘要：

A package having a recessed section, a sensor element arranged in the recessed section and having a piezoelectric material, a lid joined to the package and sealing the recessed section of the package are provided. The package has a first hollow portion which a part of the sensor element fits with, on an inner bottom surface of the recessed section. The lid has a second hollow portion which a part of the sensor element fits with.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/