#$%^&*AU2018278852A120190711.pdf#####ABSTRACT Apparatus and methods are provided for cleaning, disinfecting, and/or sterilizing a device. More specifically, a first treatment chamber can be configured to conduct a first treatment stage therein at a first pressure, a first temperature, and a first sterilant concentration. A first passage can be operatively connected to the first treatment chamber and a second treatment chamber can be operatively connected to the first passage and in communication with the first chamber via the first passage. The second chamber can be configured to conduct a second treatment stage therein at a second pressure, a second temperature, and a second sterilant concentration. An object can be treated in the first treatment chamber and moved to the second treatment chamber via the first passage to be treated in the second treatment chamber.1/4 100 104 108a Second Chamber First Chamber Object 112JFb ict 128bi 128a 1082 FIG. 12/4 200 218 [Radiation Source 228a -, 220b 202 208 2 228b 206 214 ,,'212 21 11 - 212 212 First Chamber Second Chambe Third Chamber c 2242Object Object 226 214 Shuttle System21 222 210. 216 PHD FIG. 23/4 302 Object1 1st Stage ) 2nd Stage 3rd Stage Objet2 306 304 1stStage ) 2nd Stage>； 3rd Stage Objects 1 st Stage )2nd Stage) 3rd Stage Object4 1 stStg)2nd Stage 3rd Stage Objects: 308 310-J 1st Stage 2nd Stage 3rd Stage TIME T1 T2 T3 T4 300 FIG. 34/4 400 Place object into a first chamber _ 402 Treat object in a first stage Move object from the first chamber _ 406 into a second chamber Treat object in a second stage Move object from the second chamber 410 into a third chamber Treat object in a third stage 412 Remove object from the third chamber 414 FIG. 4
