A packaged circuit system structure with circuit elements (301,304) embedded into a bulk material (322). At least one of the embedded circuit elements (301,304) forms a dual coupling that includes an electrical connection to a signal ground potential (350) on one side (324) of the structure and an electrical connection to a conductive layer (316) on the other side of the structure. The conductive layer extends over at least one embedded circuit element (304) that does not form a dual coupling, and thereby provides an effective EMI shielding for it.
