光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置
- 专利权人:
- 日立化成株式会社
- 发明人:
- 小谷 勇人,浦崎 直之
- 申请号：
- JP20090084900
- 公开号：
- JP6133004(B2)
- 申请日:
- 2009.03.31
- 申请国别(地区):
- 日本
- 年份:
- 2017
- 代理人:
- 摘要：
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for light reflection, allowing formation of a cured product that can sufficiently reduce leakage of light in a substrate for mounting optical semiconductor elements, to provide a substrate for mounting the optical semiconductor elements and a method of producing the substrate using the composition, and to provide an optical semiconductor device.
SOLUTION: The thermosetting resin composition for light reflection comprises a thermosetting resin containing epoxy resin, and an inorganic oxide having a refractive index of 1.6 to 3.0, wherein the compounded amount of the inorganic oxide is from 70 to 400 pts.mass based on 100 pts.mass of the thermosetting resin.
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- 来源网站：
- 中国工程科技知识中心
