Provided is a circuit structure formed in a shape that includes: a multilayer substrate formed by making multilayered first to N-th (N is an integer, at least 2) tri-plate structures which respectively include first to N-th planar conductors; an interlayer connection conductor that connects the first to N-th planar conductors to each other; and a side surface grounding conductor which is formed on a side surface of the multilayer substrate and which is substantially parallel to and near the interlayer connection conductor.
