An adhesive film for protecting the surface of a semiconductor wafer has a base film and an adhesive layer on one surface of the base film. The adhesive layer contains: a polymer (A), the dynamic viscoelasticity (tanδ) of which is at its maximum at a temperature of 0℃ or more; and a polymer (B) the dynamic viscoelasticity (tanδ) of which is at its maximum at a temperature of 0℃ or less, in a mass ration (A/B) of 57/43 to 90/10. The polymer (A) contains 22 to 30 mass % of structural units derived from acrylonitrile or methacrylonitrile. The adhesive film for protecting the surface of a semiconductor wafer has an adhesibility of 1,0N/25mm or more at a peal rate of 10mm/min.
