Janusz Bryzek,Sandeep Akkaraju,Yusuf Haque,Joe Adam
申请号：
US15933309
公开号：
US20190290243A1
申请日:
2018.03.22
申请国别(地区):
US
年份:
2019
代理人:
摘要：
A transducer assembly includes: a microelectromechanical systems (MEMS) die including a plurality of piezoelectric elements； a complementary metal-oxide-semiconductor (CMOS) die electrically coupled to the MEMS die by a first plurality of bumps and including at least one circuit for controlling the plurality of piezoelectric elements； and a package secured to the CMOS die by an adhesive layer and electrically connected to the CMOS die.
