Rohm and Haas Electronic Materials CMP Holdings, Inc.
发明人:
Nguyen John Vu,Tran Tony Quan,Hendron Jeffrey James,Stack Jeffrey Robert
申请号：
US201715726027
公开号：
US2018366333(A1)
申请日:
2017.10.05
申请国别(地区):
美国
年份:
2018
代理人:
摘要：
The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.
