APPARATUS CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, SYSTEM CONFIGURED FOR SPUTTER DEPOSITION ON A SUBSTRATE, AND METHOD FOR SPUTTER DEPOSITION ON A SUBSTRATE

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专利权人:

APPLIED MATERIALS, INC.

发明人:

WHITE, John M.

申请号：

WO2016US29740

公开号：

WO2017074504(A1)

申请日:

2016.04.28

申请国别(地区):

世界知识产权组织国际局

年份:

2017

代理人:

摘要：

The present disclosure provides an apparatus configured for sputter deposition on a substrate. The apparatus includes a cylindrical sputter cathode rotatable around a rotational axis, and a magnet assembly configured to provide a first plasma racetrack and a second plasma racetrack on opposite sides of the cylindrical sputter cathode, wherein the magnet assembly includes two, three or four magnets each having two poles and one or more sub-magnets, wherein the two, three or four magnets are configured for generating both the first plasma racetrack and the second plasma racetrack.

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