A method involving forming a sacrificial layer on a working substrate； forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer, wherein the first bio-compatible layer defines a first side of a bio-compatible device； forming a conductive pattern on the first bio-compatible layer, the conductive pattern comprising a metal； mounting an electronic component to the conductive pattern； forming a self-assembled monolayer (SAM) on the conductive pattern by contacting the conductive pattern with a functionalized sulfur compound or a functionalized selenium compound； forming an adhesion layer on the SAM by contacting the SAM with an adhesion promoter； forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern having the adhesion layer, wherein the second bio-compatible layer defines a second side of the bio-compatible device； and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.
