A method may involve: forming a sacrificial layer on a working substrate forming a first bio-compatible layer on the sacrificial layer such that the first bio-compatible layer adheres to the sacrificial layer forming a conductive pattern on the first bio-compatible layer mounting an electronic component to the conductive pattern forming a second bio-compatible layer over the first bio-compatible layer, the electronic component, and the conductive pattern and removing the sacrificial layer to release the bio-compatible device from the working substrate. The first bio-compatible layer defines a first side of a bio-compatible device. The second bio-compatible layer defines a second side of the bio-compatible device.
