The image pickup unit includes a substrate on which the solid-state image pickup element is mounted, a high heat generation element which is an electronic component mounted on the substrate and can be a heating element, a surface of the substrate, an outer surface of the solid-state image pickup element mounted on the substrate An insulating member covering the outer surface of the high heat generating element mounted on the substrate and the outer surface of the electronic component other than the highly heat generating element, a conductive thermally conductive resin member provided in close contact with the insulating member, And a heat dissipating member having one end portion disposed in the conductive thermally conductive resin member and the other end portion disposed at a position separated from the substrate by a predetermined distance.撮像ユニットは、固体撮像素子が実装される基板と、基板に実装される電子部品であって発熱体と成り得る高発熱素子と、基板の表面、該基板に実装された固体撮像素子の外表面、当該基板に実装される高発熱素子の外表面、及び該高発熱素子以外の電子部品の外表面を覆う絶縁部材と、絶縁部材に密着して設けられる導電性熱伝導樹脂部材と、一端部と他端部とを有し、一端部が導電性熱伝導樹脂部材内に配設され、他端部が基板から予め定めた距離離間した位置に配置される放熱部材と、具備する。
