Rohm and Haas Electronic Materials CMP Holdings, Inc.;Dow Global Technologies LLC
发明人:
Qian Bainian,Jacob George C.
申请号：
US201414576896
公开号：
US9452507(B2)
申请日:
2014.12.19
申请国别(地区):
美国
年份:
2016
代理人:
Biederman Blake T.
摘要：
The invention provides a method of manufacturing a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The method obtains a liquid polyurethane material formed from an isocyanate-terminated molecule and a curative agent. The liquid polyurethane material contains 4.2 to 7.5 weight percent fluid-filled polymeric microspheres in the isocyanate-terminated molecule. The fluid-filled polymeric microspheres are a blend of preexpanded and unexpanded fluid-filled polymeric microspheres. The liquid polyurethane material contains a blend of preexpanded and unexpanded fluid-filled polymeric microspheres having a relative viscosity;μμ0
