Copper Foil, Copper-Clad Laminate Board, Method for Producing Printed Wiring Board, Method for Producing Electronic Apparatus, Method for Producing Transmission Channel, and Method for Producing Antenna

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专利权人:

JX NIPPON MINING & METALS CORPORATION

发明人:

FUKUCHI RYO

申请号：

US201715405517

公开号：

US2017208686(A1)

申请日:

2017.01.13

申请国别(地区):

美国

年份:

2017

代理人:

摘要：

To provide a copper foil and a copper-clad laminate board that have a favorably suppressed transmission loss even in the use thereof in a high frequency circuit board that is folded in use or bent in use. A copper foil having a number of times of folding of 1 or more in a folding test under a prescribed condition for a copper-clad laminate board containing the copper foil having adhered thereto an insulating substrate.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/