An electron beam apparatus comprises a TDI sensor ( 64 ) and a feed-through device ( 50 ). The feed-through device has a socket contact ( 54 ) for interconnecting a pin ( 52 ) attached to a flanged ( 51 ) for separating different environments. The. other pin ( 53 ) making a pair with the pin ( 52 ) and the socket contact ( 54 ) together construct a connecting block, and the socket contact ( 54 ) has an elastic member ( 61 ). The pin ( 53 ) is connected with the TDI sensor ( 64 ), in which a pixel array has been adaptively configured based on the optical characteristic of an image projecting optical system. That sensor has a number of integration stages that can reduce the field of view of the image projecting optical system. Further, the number of integration stage may be determined such that the data rate of the TDI sensor would not be reduced but the number of pins would not be increased as much as possible. Preferably, the number of line count may be almost equal to the number of integration stages.
