PACING LEADS WITH ULTRATHIN ISOLATION LAYER BY ATOMIC LAYER DEPOSITION

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专利权人:

发明人:

Jan Weber,Mary M. Byron

申请号：

US14503823

公开号：

US20150039065A1

申请日:

2014.10.01

申请国别(地区):

US

年份:

2015

代理人:

摘要：

An implantable medical lead includes a substrate extending from a distal end to a proximal end of the medical lead. The substrate includes at least one polymer material and particles dispersed throughout the polymer material. In one embodiment, the particles are of at least one of nanoclay material and nanodiamond material.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/