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Thin film deposition system capable of physical vapor deposition and chemical vapor deposition simultaneously
专利权人:
The Regents of the University of California
发明人:
Kobayashi Nobuhiko
申请号:
US201615544100
公开号:
US2018002810(A1)
申请日:
2016.01.20
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
A multi-deposition chamber apparatus is provided that includes a first deposition chamber that includes a substrate holder, a retractable sputter gun, a gate valve, an output port, a retractable chamber separator, a gas input port, a gas output port, and an electron cyclotron resonance plasma source, where the retractable chamber separator is configured to selectively segment the first deposition chamber to form a second deposition chamber, where the second deposition chamber comprises the substrate holder, the gas input port, the gas output port and the electron cyclotron resonance plasma source.
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中国工程科技知识中心
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